Ultra-thin Diamond Dicing Blades

Diamond dicing blades are mainly used to cut delicate materials such as wafers, and are an indispensable tool in the semiconductor packaging process. In addition, it is also suitable for the processing of electronic components, optical components, and various semiconductor packaging components, such as the cutting of ceramics, single crystals, ferrites, glass and other materials. The cutting of high-loaded, difficult-to-cut materials, such as crystals, deep grooving, etc., demonstrates its excellent cutting ability. It is also used in machinery manufacturing, construction and other industries, such as for the cutting of hard materials such as metal and stone. Diamond dicing blades play an important role in many industrial sectors due to their high hardness, wear resistance and excellent cutting performance.

Parameters and Details of Ultra-thin Diamond Dicing Blade

Performance features of Diamond Dicing Blades

1. Excellent grinding ability and high wear resistance ensure a long service life of the blade.
2. The high hardness of the binder makes the blade highly rigid, so that the blade does not deform during the cutting process, thus ensuring the verticality of the cutting surface.
3. Through fine preparation of the concentration and particle size of the abrasive, good cutting efficiency can be achieved while meeting the requirements for cutting surface finish.
4. Advanced and scientific processing methods and strict process control ensure that the shape, position and size of the blade have high precision.
5. The precise classification of binders meets the requirements for selecting special blades for processing different materials.
6. Suitable for single piece use or multi-knife combination cutting.
7. High precision, can be used for precision grooving and cutting, which can reduce subsequent processing steps.
8. Narrow cutting slit, which can greatly improve the utilization rate of precious raw materials.
9. High efficiency, sharp cutting, no need for frequent tool changes.
10. High rigidity. High strength and long service life.

Application Areas

1. Carbide (YG8) rods and plates, tungsten steel round rods, (bar cutting in sections) drill bits, PCB board drill bits, mold ejector pins, mold tops, motor poles, gong knives, shuttles in the textile industry, and machine tools Shaft diameter, machine tool axis, woodworking tools, high-precision and high-wear-resistant molds, progressive molds, anti-piracy, X-ray radiation protection panels, cutting tools, heterosexual parts, etc.;
2. Fuse glass tube;
3. Optical glass, quartz glass, various glass tubes, crystallized glass, gems, crystals, jade, etc.;
4. Silicon oxide/zirconia/alumina/black ceramics/glass products/ceramic tubes, etc.;
5. Sapphire;
6. Quartz borosilicate glass tubes, quartz tubes, electrodeless lamps, U-shaped tubes, electronic cigarette tubes, chemical experiment equipment, etc.;
7. Open the glass (tea drain);
8. Quartz glass tubes, quartz glass rods, quartz glass sheets, quartz glass weights, fused silica glass tubes (furnace core tubes), fused silica glass rods, quartz glass boats, quartz crucibles, etc.;
9. Magnetic materials: NdFeB, silicon steel, amorphous, nanocrystalline, ferrite, magnetic powder core, etc.;
10. Optical glass: camera lens, microscope lens, magnifying glass lens, telescope lens, eyeglass lens, optical prism;
11. PCBcircuit board.
12. Semiconductor industry: It is mainly used for cutting precision materials such as wafers, and is an indispensable tool in the semiconductor packaging process.
13. Electronics industry: It is suitable for the processing of electronic components, optical components, various semi-conductive 13 and bulk packaging components, such as the cutting of ceramics, single crystals, ferrites, glass and other materials.
14. High-load, difficult-to-cut materials: It can handle high-load and difficult-to-cut materials, such as crystal, deep groove machining, etc., showing its excellent cutting ability.
15. Other industrial fields: It is also used in machinery manufacturing, construction and other industries, such as for the cutting of hard materials such as stone and metal.

Classification and Characteristics of Binders

•  Metal-bonded (M) metal-bonded cutting disc has strong holding strength, high wear resistance, good edge shape retention and long service life.
• Resin binder type (R) resin binder cutting disc has good self-sharpening, sharp cutting, high efficiency, easy to achieve large depth of cut and large feed; The binder is elastic and improves the processing quality and workpiece finish.

Precautions for Safe Use

1. Please check carefully before loading the cutting wheel, and stop using it if there is a gap or other damage.
2. When the diamond dicing blades are marked with the direction of rotation, it should be consistent with the direction of rotation of the machine tool. On the contrary, the cutting is not sharp, and it is difficult to exert the performance of the cutting wheel.
3. Do not use a cutting wheel that does not meet the requirements.
4. If any abnormality is found during the cutting process, the machine should be stopped immediately to investigate the cause.
5. When the cutting is not sharp, the grinding wheel should be trimmed and sharpened. If you continue to use it, there is a possibility that the grinding wheel will be damaged due to overheating and overload.
6. During the rotation of the grinding wheel, it is strictly forbidden to operate the cutting by hand, and it is not allowed to touch the grinding wheel with hands and body.
7. Diamond dicing blades are forbidden to be used for operations other than grooving or cutting to avoid abnormalities due to uneven force.